Last year at DesignCon 2022, Test & Measurement Product Manager at Rosenberger North America, Bruce Cardwell, presented a product showcase on our WSMP™ NexGen product series. Cardwell developed the WSMP™ NexGen and during his 2022 presentation, he defined the benefits of the connector series and how it expanded to include PCB Connectors, adaptors (bullets), multipin connectors and cable assemblies.
This year, Rosenberger North America's Sales & Marketing Vice President, Nick Parker, joined Cardwell in an in-depth Q&A on the WSMP™ NexGen series. This Q&A delved into applications you may not have thought about, eliminating barriers to adoption and how the WSMP™ NexGen series can be used by the American Military & Aerospace market.
Rosenberger WSMP™ NexGen connectors are a push-on/blind mate interconnect system that provide superior flexibility for your design. WSMP™ connectors are approximately 45 percent smaller than standard SMP connectors and offer a high-frequency performance beyond 100 GHz.
The outstanding features of this product include extremely high packing densities and minimum board-to-board distances of 3.91 mm.
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