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Testing and Qualification
All methods for reproducible simulation of environmental influences, the methods for associated function monitoring and the subsequent analysis of results assume the use of modern technology. The in-house test laboratory has the necessary equipment to record all the relevant values during product testing.   
 
X-Ray System and Computerized Tomography
X-Ray System and Computerized Tomography
A high-resolution X-ray system enables a non-destructive view into the interior of the test objects, both in 2D mode as well as for 3D computer tomography imaging. Superimposition of the tomography data on a 3D model from CAD data facilitates the color representation of divergences from the geometric ideal.
Scanning Electron Microscope with EDX
Scanning Electron Microscope with EDX
Scanning Electron Microscope with EDX
This technology allows magnification by a factor of up to 300,000. In combination with an energy dispersive X-ray spectroscopy (EDX), the information concerning the existing chemical elements can be obtained. The colored representation provides the system with information concerning the local occurrence of these elements.
Passive Intermodulation Analyzer
Passive Intermodulation Analyzers (PIA) from Rosenberger facilitate quick and accurate measurement of the intermodulation characteristics of passive components, such as connectors, cable assemblies, antennas or filters. Precise analysis of the mobile communication infrastructure quality is also possible.
Electrical Measurement Devices
Electrical Measurement Devices
Electrical Measurement Devices
Measurement and test equipment is available for measurement of all functional-relevant electrical values, which also cover the highest performance areas.
  • Electrical voltage up to 30 KV
  • Electrical currents up to 1000 A
  • High frequency measurements up to 110 GHz
  • Electrical resistances up to 1014 ohms
  • Electrical capacitances up to 370 mF
  • Electrical inductance up to 750 kH
  • Magnetic flux density up to 1999 mT
Tractive/Compressive Force Test Stands
Tractive/Compressive Force Test Stands
Tractive/Compressive Force Test Stands
A whole range of mechanical forces occur in electrical connector systems, e.g. mating and separation forces, cable holding forces, contact normal forces and bending forces. These forces are simulated on various force test stands. This equipment allows the measurement of forces up to 250 kN.
Reflow
Reflow
Many connectors are soldered directly onto a PCB. In addition to the solderability, the resistance to the heat produced by soldering is one of the significant factors in this area of testing. Only choice material selection and error-free cut off with the coating allow this test to be passed successfully. Only thus is reliable workability assured for the customers.
Thermal Imaging
Thermal Imaging
Thermal Imaging
In order to not affect the RF performance of a connector by the attachment of temperature sensors, the non-contact thermal imaging process is used to ensure temperature measurement on a connector while it is in use. At a glance the temperature distribution and any local hot spots can be detected. The system employed facilitates a thermal resolution of 0.08 K.
Thermal Shock / Temperature Cycle Test
Thermal Shock
Electromechanical components are frequently used in extremely critical areas. An extremely wide variety of loads occur in combination and these make extreme demands as regards material and design. A robot-controlled test facility at Rosenberger allows temperature cycling tests which run automatically to be conducted. Here, you can see an ice water immersion test.