Rosenberger Hochfrequenztechnik GmbH & Co. KG
en

Mechanical Design

 

In Addition to Fixed Systems Pioneering Technologies such as the Internet of Things (IoT) and Autonomous Driving Require Very Small and Highly Flexible PCBs

Because of the increasing level of miniaturization and the growing cost considerations regarding connectors and cables, the analysis and prediction of mechanical properties of Rosenberger products has become increasingly important.

To precisely satisfy these requirements the company uses its own in-house simulation capabilities and test methods.

 

Materials Analysis

Rosenberger products are subjected to high mechanical and tribological demands. To meet these a comprehensive and uncompromising product development and  testing regime is necessary ensuring maximum product performance:

  • REM and EDX analytics are deployed for evaluation of wear on galvanic surfaces
  • Metallography is applied in the identification of possible microstructure crack formations
  • CT generated images are used for checking fiber-glass alignment in GRP components
  • Measuring the elasticity of modules and their elongation at break is undertaken - as part of rupture stress testing in FEM simulation
 

Mechanical Component Design

The extreme mechanical demands placed on Rosenberger products demands a thorough inspection of their most important properties in the very early phases of development.

Using the Finite-Elemente-Methode (FEM) Rosenberger is able to predict with a high level of accuracy spring properties, rupture force (fiber-glass reinforced plastics) and permanent deformation.

As part of the simulation process non-linearity of contact, material and structure is assessed - with very precise results. Additionally, a thermal field analysis are undertaken to determine the flow of heat in components and assemblies.

Micro Mechanics

The development and production of micromechanical components are necessary to satisfy ongoing market and customer demands for miniaturization and higher frequencies.

This is applies not only to the production of standard products but also individual items.

In the field of micro mechanics Rosenberger uses LIGA contact springs for wafer probes due to the need for precision where even the smallest dimensions can contribute to lossless transmission of signals. The company’s experience and competence in analyzing and processing thin layer substrates is also of importance.

Coax Wire Bond – Innovative Technology with Future

With the future-oriented Coax Wire Bond technology developed by Rosenberger there are new real possibilities for improving signal transmission with real coax connectivity on μm scale. Instructions from semiconductors are transmitted to the Wire Bonds for enabling impedance-controlled coax connection and feature an outside diameter of 70 μm.

The resultant bandwidth improvement, through EMI and crosstalk current reduction, enables innovative solutions for demanding high-frequency applications.